Against the backdrop of rapid iteration in new energy vehicles (NEVs) and intelligent connected vehicles (ICVs), the automotive industry is accelerating its transition toward electrification and smart mobility. As a fundamental enabler of automotive upgrades, automotive-grade semiconductors have become crucial to securing supply chain resilience and achieving technological self-reliance. As China’s automotive semiconductor sector continues to make technological breakthroughs, key priorities now include domestic supply chain substitution, automotive-grade qualification and certification, vehicle-level integration and validation, and large-scale deployment across diverse application scenarios—all essential pillars for high-quality industry growth.
Under the theme “Connecting Chips to Mobility, Driving the Smart Future: Building a High-Quality Automotive Semiconductor Application Ecosystem,” the Automotive Semiconductor Ecosystem Development Forum 2026 will feature a comprehensive program including policy briefings, keynote presentations, executive panel discussions, and targeted business matchmaking sessions. Bringing together government authorities, research institutions, OEMs, Tier 1 suppliers, AI technology developers, and investment organisations, the forum will explore critical topics such as automotive semiconductor innovation, localisation pathways, automotive electronics integration, vehicle application deployment, end-to-end supply chain collaboration, and intelligent mobility technologies, accelerating the development of a resilient and competitive automotive semiconductor ecosystem.
| Date | 3 December 2026 |
| Time | 13:30 – 17:20 |
| Venue | Hall 4.2, NECC (Shanghai) |
2026 topics include:
1. Automotive-Grade Chip Localisation: Qualification, Certification and Vehicle Integration Pathways
2. Power Semiconductor Iteration and Application Integration for New Energy Vehicles
3. Core Chip Solutions and Commercial Deployment for Autonomous Driving and Smart Cockpits
4. Domestic Substitution for Automotive MCUs, Sensors and Memory Chips: Challenges and Strategic Breakthroughs
5. Functional Safety, Chip Reliability Testing and Quality Assurance Frameworks for Automotive Electronics
6. Embodied AI Automotive Chips and Edge Computing: Practical Applications in Smart Vehicles and Mobile Robotics
7. Power Semiconductors and High-Reliability Chips for Low-Altitude Economy (eVTOL & Flying Cars): Localisation and System Integration
*Updated as of Jul 2026. The conference schedule and speakers are subject to change.