Driven by the modernisations (C.A.S.E.) of the automotive industry, chassis systems are evolving toward fully by-wire distributed architectures and integrated wheel-end solutions. With the rapid commercialisation of high-level intelligent driving, drive-by-wire chassis, chassis domain controllers, active suspensions, and automotive chips have become the core enablers of vehicle intelligence.
The Intelligent Chassis Technology Forum 2026 directly addresses these industry trends. Focusing on smart corner modules, commercial deployment, supply chain localisation, system safety, and multi-domain convergence, this forum provides an high-end collaboration platform connecting OEMs, Tier-1 suppliers, semiconductor companies, and research bodies. Join us to expand real-world testing scenarios, shape industry standards, and drive large-scale commercialisation of next-generation chassis technologies.
| Date | 4 December 2026 | |
| Time | 13:40 – 17:00 | |
| Venue |
Meeting Room 502, NECC | |
Conference Agenda
| Time | Topic | Speakers |
| 13:40 | Welcome Speech | Stay tuned |
| 13:50 | Analysis of Key Technological Trends for Intelligent Chassis of Embodied Intelligent Vehicles | |
| 14:15 | Testing Technologies for Corner Modules | |
| 14:45 | Active Wheel Corner Module Technology | |
| 15:10 | Real-World Challenges in Intelligent Chassis Development | |
| 15:35 | Intelligent Chassis Actuators Research and Development and Production | |
| 16:00 | Networking & Group Photo | |
| 16:30 | Closed-door Session of the Intelligent Chassis Working Group |
*Updated as of Oct 2026. The conference schedule and speakers are subject to change.