Special highlights Skip

Special highlights

In 2026, Hall 5.1 newly features three dedicated zones designed to support the industry’s most urgent growth priorities. Together, they showcase how next-generation mobility is being enabled through integrated vehicle–air–network applications, stronger global quality and compliance frameworks, and a complete automotive-grade semiconductor ecosystem. By connecting technology innovation with certification pathways and supply-chain readiness, these zones help OEMs and suppliers accelerate commercialisation, improve reliability, and build the capabilities needed for international and future markets.

Air-Ground Integrated Intelligence Zone

Featuring brands like C*Core, GALILEO, JINGWEI HIRAIN, NEOLIX, Starway and ZHUOYI, this zone focuses on emergency response and safety inspection scenarios. It presents an immersive experience combining drones, L4 autonomous vehicles, low-earth orbit satellites, and robotic dogs, along with interactive intelligent and health cockpit displays. The zone showcases cutting-edge intelligent connectivity and autonomous driving technologies, promoting integrated applications across vehicles, machines, and networks.

Global Quality Alliance Hub

Centered on the automotive IATF 16949 quality management standard, this zone brings together standards bodies, trainers, certifiers, and regulators to build a robust quality management ecosystem. Held alongside the AIAG Asia Quality Summit 2026, it provides guidance on the 2026 standard update, quality systems, carbon management, and compliance requirements for global markets. Additional fringe events, such as the Automotive Supply–Demand Matching Series, facilitate matchmaking between suppliers and OEMs, fostering direct connections that support the internationalisation of China’s automotive industry.

Automotive Semiconductor Ecosystem Zone

This zone showcases the complete automotive-grade semiconductor industry chain, featuring companies involved in chip design, wafer fabrication, packaging and testing, third-generation power semiconductors, in-vehicle computing chips, microcontrollers (MCUs), sensors, automotive certification, and automotive electronic components. It also highlights cutting-edge sectors such as airborne semiconductors for the low-altitude economy and intelligent embedded hardware for vehicles, representing the forefront of technological innovation.